Extra Large Back Cooling Plate with Washable Adhesive for Long Time Use in High Load Scenario Semiconductor Compatible Phone Cooling

Extra Large Back Cooling Plate With Washable Adhesive For Long Time Use In High Load Scenario Features: Efficient VC Cooling Technology: Features a large area VC chamber with vacuum liquid cooling structure that rapidly dissipates heat and balances device temperature, eliminating localized overheating for smooth Full Coverage Cooling Design: Extra large size provides comprehensive coverage of phone hotspots, offering wider thermal conductivity and faster heat dissipation during gaming, streaming, or heavy usage Washable Adhesive: Equipped with washable adhesive that stays firmly attached; simply rinse with water to restoration stickiness for repeated use without leaving residues Semiconductor Cooling Compatible: Works synergistically with semiconductor cooling for double cooling (VC + thermoelectric), strong heat transfer and lower temperatures to throttling in high load scenarios High Purity Copper Base: Premium copper with excellent thermal conductivity to instantly spread heat and maintain balanced device temperature for long lasting comfort Specifications: Component: metal Dimensions: 114.4X73.4X33.4Mm / 4.5X2.89X1.31Inch Usage scenarios: gaming phone cooling | long-term cooling | high load scenarios Package Includes: 1Pc Heat Dissipation Pad Note: Please allow 1-2cm errors due to manual measurement Please allow for slight color differences due to different display resolution

• High Purity Copper Base: Premium copper with excellent thermal conductivity to instantly spread heat and maintain balanced device temperature for long lasting comfort
• Efficient VC Cooling Technology: Features a large area VC chamber with vacuum liquid cooling structure that rapidly dissipates heat and balances device temperature, eliminating localized overheating for smooth
• Washable Adhesive: Equipped with washable adhesive that stays firmly attached; simply rinse with water to restoration stickiness for repeated use without leaving residues
• Full Coverage Cooling Design: Extra large size provides comprehensive coverage of phone hotspots, offering wider thermal conductivity and faster heat dissipation during gaming, streaming, or heavy usage
• Semiconductor Cooling Compatible: Works synergistically with semiconductor cooling for double cooling (VC + thermoelectric), strong heat transfer and lower temperatures to throttling in high load scenarios